Conductive Nano Silver Ink
₹22590.00
Conductive Nano Silver Ink — Technical Specifications
Below is a professional TDS-style specification suitable for a catalogue, quotation, or product datasheet. Exact values should be confirmed against your formulation and batch COA.
Parameter | Typical / Target Specification |
|---|---|
Product Name | Conductive Nano Silver Ink |
Material Type | Silver nanoparticle-based conductive ink |
Active Material | Silver (Ag) nanoparticles |
Silver Content | 20–60 wt.%* |
Particle Size | 10–100 nm |
Average Particle Size | 20–50 nm* |
Appearance | Metallic silver / grey liquid |
Form | Stable liquid dispersion |
Carrier System | Water-based or solvent-based* |
Viscosity | 5–20 cP @ 25°C* |
Density | 1.2–2.0 g/cm³* |
pH | 6–9 for water-based grade* |
Surface Tension | 25–40 mN/m* |
Recommended Film Thickness | 0.5–10 µm* |
Sheet Resistance | ≤0.1–10 Ω/□*, depending on film thickness and curing |
Resistivity | Typically 10⁻⁶–10⁻⁵ Ω·m after optimized curing* |
Electrical Conductivity | High; formulation and curing dependent |
Substrate Compatibility | PET, PI, glass, ceramic, silicon and selected metals* |
Printing Method | Inkjet / screen / flexographic / gravure* |
Curing Temperature | 80–200°C*, depending on substrate and formulation |
Curing Time | 5–60 min* |
Adhesion | Good to excellent on compatible substrates |
Flexibility | Good for flexible-substrate grades |
Thermal Stability | Good |
Storage Temperature | 5–25°C |
Shelf Life | Typically 6–12 months* |
Packaging | 10 mL, 25 mL, 50 mL, 100 mL, 500 mL, 1 L or customized |
Key Features
High electrical conductivity
Nano-sized silver particles for fine-feature printing
Suitable for printed electronics
Low-temperature curing options available
Excellent conductivity after sintering/curing
Suitable for conductive traces and electrodes
Compatible with rigid and flexible substrates, depending on grade
Typical Applications
Printed electronic circuits
Flexible electronics
RFID antennas
Touch-screen electrodes
Conductive tracks
Sensors
Printed heaters
Solar-cell electrodes
EMI shielding
Membrane switches
PCB and electronic prototyping
Recommended Characterization
For a commercial-grade TDS, I recommend measuring:
SEM/TEM → Ag nanoparticle size
DLS → Dispersion particle-size distribution
XRD → Metallic Ag phase
ICP-OES/ICP-MS → Silver concentration
Four-point probe → Sheet resistance
Profilometry → Printed film thickness
Contact-angle measurement → Substrate wettability
Adhesion test → ASTM D3359
TGA → Organic/metal content
Viscosity/rheology → Printing behavior
Note: Sheet resistance and resistivity depend strongly on silver loading, nanoparticle size, printed thickness, substrate, printing method, and curing/sintering conditions. For a customer-facing TDS, these should be reported as measured values for your specific ink rather than as universal specifications.